HyperDense™ modules

HyperDense™, the first product line in the company’s Light on Board® product family consists of parallel channel optical components integrated into a high-density module that focuses on intra and inter printed circuit board (PCB) applications and supports all physical layer protocols.

Each HyperDense™ board comprises of multiple LightABLE™ optical engines mounted on a small PCB. The LightABLE™ optical engines have 12 individual parallel fiber optic channels integrated into MT-based I/O connector module, with each channel capable of speeds of up to 10 Gbps. The LightABLE™ optical engines come in three forms: 4 TX + 4 RX, 12 TX or 12 RX within a single optical engine.

The tightly packed optical channels on the HyperDense™ package eliminate the difficulties of routing long high-speed traces on the PCB by placing the HyperDense™ optics right next to the ASIC on the Host PCB.

HyperDense™ packaging has no impact on existing electrical design protocols. This technology provides an extremely cost-effective solution for utilizing the full bandwidth of high-performance chips.

Specifications and Features Highlights:

• HyperDense™ Pre-Packaged Parallel Optical Components:
  • Up to 8 LightABLE™ optical engines per module
• Up to 10 Gbps per channel
• Transmission distances up to 300 m on multimode optical fibers
• Low-profile, pre-aligned LightABLE™ optical engines
• Custom package sizes available
• RoHS compliant
• Excellent thermal performance
• Significantly lower system cost for high-speed data routing
• Lower overall system power consumption
• Increased packing density
• Improved high-speed signal integrity
• Improved EMI performance
  

Applications:

High-speed optoelectronic data conversion for

• 1G & 10G Serial Ethernet
• 4 x 3.125G 10G Ethernet links
• 4G & 8G Fibre Channel
• InfiniBand® DDR and QDR
• PCI Express® 1.1, 2.0 and 3.0
• Serial Rapid IO™
• SATA-IO™ 3.x
• Proprietary inter and intra board systems
  
  

HyperDense™ modules - Documentation