Light On Board® OE-BGA Cavity Down

Optically-Enabled Ball Grid Array (OE-BGA) Light On Board®: Cavity Down Package

The high performance optically enabled BGA packages are offered in a deep cavity down architecture with multiple wire bonding tiers for power, ground, electrical signals and optical signals. The integrated circuit (IC) is mounted on a copper heat spreader and each optical MT connector consists of up to 16 independent transmit or receive optical channels. Each channel is capable of transmitting up to 10Gb/s up to 300m on 50-micron multimode fiber.

Additionally, the optical BGAs utilize industry proven, semiconductor grade materials for reliable, long-term operation while providing the user flexible design parameters. The packages have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference, and integrate Reflex’s next generation, LightABLE optical packaging technology.

Key Benefits:

• High-speed Optical Inputs and Outputs Directly to the Chip
  
• Outstanding high-speed capabilities via LightABLE™ optical technology
  
• Up to 960 Gb/s of Unidirectional Optical Bandwidth
  

Specifications and Features Highlights:

• Inverted Cavity Configuration
  
• Die sizes up to 400X400 mils
  
• 352 to 1140 ball count
  
• Custom packages in body sizes ranging from 35 x 35 mm to 45 x 45 mm
  
• 0.8, 1.0 & 1.27 mm ball pitches available
  
• Superior Thermal Performance
  
• Up to 96 Optical Input or Output channels
  
• Up to 10 Gb/s per channel optical performance
  
• Excellent Reliability
  
• Up to 10 Laminate Metal layers
  
• Optional grounded heat spreader
  
• Deep Cavity Down Architecture with Multiple Wire Bonding Tiers
  
• Eutectic of Pb-free versions available

Applications:

• High-speed, high-power semiconductors:
  • ASICs
  • Microprocessors
  • DSP and FPGA requiring high-performance packages.
    
• Solution for bandwidth, power and space requirements of:
  • Internet Routers
  • Switches
  • Network Servers
  • Systems on a Chip
    

Light on Board® OE BGA Cavity Down Packaging - Product Briefs & White Papers