Light On Board® OE-BGA Flip Chip

Optically-Enabled Ball Grid Array Light On Board® Flip-Chip Package

Reflex Photonics’ Optical Flip-Chip BGA semiconductor packaging technology combines the benefits of optical transmitter and receiver interconnections with the advantages of wafer bumping technology. The ability to connect optical signals to the package effectively enables a “fiber-to-the-chip” connection. This innovative technology incorporates the most advanced assembly processes, which allows applications to maximize the bandwidth of semiconductor integrated circuits (ICs).

The high performance optical FC-BGA packages introduce ASIC/SOC design flexibility by allowing optimized signal I/O placement. Each optical MT connector consists of up to 16 independent transmit or receive optical channels. Each channel is capable of transmitting up to 10 Gb/s up to 300m on 50-micron multimode fiber.

Additionally, the optical FC-BGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters. The packages have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference and integrate Reflex’s next generation, LightABLE™ optical packaging technology.

Key Benefits:

• High-Speed Optical Transmit and Receive Capability Interconnected to the Chip
  
• Outstanding high-speed capabilities via LightABLE™ optical technology
  
• Up to 960 Gb/s of Unidirectional Optical Bandwidth
  

Specifications and Features Highlights:

• Signal placement throughout die
  
• Die sizes up to 400X400 mils
  
• Up to 1936 solder balls
  
• Custom packages in body sizes ranging from 35 x 35 mm to 45 x 45 mm
  
• 1.0 & 1.27 mm ball pitches available
  
• Controlled Impedance Electrical I/O
  
• Up to 96 optical channels
  
• Up to 10 Gb/s per channel optical performance
  
• Excellent Reliability
  
• Up to 10 Laminate Metal layers
  
• Optional grounded heat spreader
  
• Eutectic of Pb-free versions available

Applications:

• High-speed, high-power semiconductors:
  • ASICs
  • Microprocessors
  • DSP and FPGA requiring high-performance packages.
    
• Solution for bandwidth, power and space requirements of:
  • Internet Routers
  • Switches
  • Network Servers
  • Systems on a Chip
    

Light on Board® OE BGA Flip Chip Packaging - Product Briefs & White Papers