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Reflex
Photonics Announces Company’s First Light on Board®
Product Line - HyperDense™
Company to Demonstrate Industry-leading,
1000 Gbps-capable, parallel optical components at Electronic
Components and Technology Conference (ECTC)
Orlando, Florida - Electronic Components
and Technology Conference (ECTC) - May 27, 2008 -
Reflex Photonics, an advanced developer of extreme high-speed
optical connectivity solutions for semiconductor packaging
and data transfer applications, announces Light on Board®
HyperDense™, a product line of parallel channel optical
components that focus on intra and inter PCB applications
and support all physical layer protocols.
HyperDense, the first product line in the company’s
Light on Board product family of optically enabled semiconductor
packaging solutions for ultra short reach (USR) interconnections
to and between IC packages on a single PCB, will be demonstrated
at ECTC, Lake Buena Vista, Florida, (www.ectc.net)
May 27-30, at Reflex Photonics’ booths #517 and #519.
“The Light On Board HyperDense IC package demonstrates
the natural evolution of optical interconnections towards
the microchip”, said David Rolston, CTO, Reflex Photonics.
“The technology adds tremendous I/O bandwidth to the
microchip package without disturbing the current design and
manufacturing methods of chips, IC packages or printed circuit
boards”.
Each HyperDense component features 12 individual parallel
fiber optic channels integrated into MT-based I/O connector
modules, with each channel capable of speeds of up to 10 Gbps.
The HyperDense products can be configured as transmitters,
receivers or transceivers, with up to eight I/O connector
modules available to be ordered for each type of product.
At a full configuration, the HyperDense transmitters and
receivers each will be able to handle an aggregate of up to
1000 Gigabits (1 Terabit) per second with the 96 channels
each running at 10 Gbps. The transceivers can handle simultaneous
bi-directional data in the aggregate of up to 480 Gbps, with
each of the 48 receive and 48 transit channels running at
10 Gbps.
Enabling Technology
Light
On Board® technology is designed to augment industry
standard IC packages with the addition of optical interconnects
without changing the chip, the IC package or the PCB manufacturing
methodology. Reflex Photonics’ Light On Board
technology continues to respect all aspects of IC packaging
and board assembly such as package size, footprint, solder-re-flow
and chip interconnections since it is extremely important not
to disrupt the processes developed by IC and PCB manufacturers.
All existing electrical high-speed connections to the ASIC are
maintained in addition to the optical connections added with
Light on Board and all optically enabled chip packages
are connected via industry standard multi-fiber ribbon cables
and patent pending Light on Board mating clips.
Light on Board enabling technology provides a platform
for connections to ASICs by introducing pre-aligned optical-to-electrical
(or electrical-to-optical) channel connector modules into
standard IC packages. Integrated within the channel connector
modules are Reflex’s pre-aligned optical engines –
called LightABLE™ Optical Sub-Assemblies (OSA):
compact, encapsulated, thin modules that can be pick-and-placed
into the IC package along side the chip. The distance between
the ASIC and the LightABLE OSA is significantly less
than one inch, in order to immediately convert the ultra-high
speed electrical signals into optical signals. Because Light
on Board focuses on USR interconnects to and between ICs on
a single printed circuit board, it effectively enables “chip
package-to-chip package” and “fiber-to-the-chip
package” solutions.
“Reflex Photonics’ technology enables next generation
computing and switching applications and presents a compelling
choice for both commercial and consumer electronics’
implementations for multiple high-speed inputs and outputs.
Light On Board, while providing developers with opportunities
for very significant savings relative to size, power, board
space and signal fidelity performance improvements, is a broad
platform merging the data communications abilities of optics
with the computing wizardries of silicon in a cost effective
manner like never before,” stated Gary Moskovitz, president
and CEO of Reflex Photonics. “We look forward to introducing
additional product lines, and strategic partner application-specific
solutions, to our Light on Board family later this
year.”
About Reflex Photonics
Founded in 2002, Reflex Photonics is an advanced developer
of extreme high-speed optical connectivity solutions for semiconductor
packaging and data transfer applications. Through the integration
of its unique and proprietary LightABLE™ core
technology, Reflex Photonics focuses on both inter printed
circuit board applications, with its InterBOARD®
product line of parallel modules and active optical cables,
as well as intra pc board and "fiber to the chip package"
applications, using its Light On Board® optically-enabled
semiconductor packaging solutions. The company addresses the
growing demand for high-speed interconnects in enterprise-class
storage/server environments and telecom-class switches/routers,
enabling equipment developers to design smaller, lower cost
and lower powered systems that result in higher fidelity and
faster connectivity.
InterBOARD™, LightABLE™, Light
on Board™, Reflex Photonics and the Reflex Photonics
logo are trademarks of Reflex Photonics Inc.
Media Contact
Jason Caldwell
Shelton Group
972-239-5119 x206
jcaldwell@sheltongroup.com
Tel: (650) 632-4557
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