Reflex Photonics provides advanced optical
interconnects based on its unique, high-volume and low-cost
approach to optical assembly. Using its core LightABLE™
technology the following market segments are addressed:
Reflex Photonics offers two families of
parallel optical modules:
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SNAP12 Parallel Optical
Modules
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| The Transmitter
and Receiver modules enable high performance multi-channel
optical links designed for high-speed data communications
and computing applications where very short reach bandwidth
bottlenecks are incumbent. These modules are compliant
to the SNAP12 MSA and are adopted by the leading systems
OEMs for chassis intra-connect. In terms of Gb/s, they
offer a solution with the lowest cost and the highest
packaging density. Consisting of 12 independent optical
channels, each channel is capable of transmission speeds
of up to 6.25 Gbps and for distances of up to 300-m
on 50 micron multimode optical fiber.
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QSFP Parallel Optical
Transceivers
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| The newly developed
Quad Small Form-factor Pluggable (QSFP) transceiver
is a highly integrated 4-channel optical module that
provides increased port density and total system cost
savings. The QSFP full-duplex optical modules offer
4 independent transmit and receive channels, with initial
models each capable of 5 Gb/s per channel operation
for an aggregate bandwidth of 20Gb/s over 300 meters
of optical fiber.
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QSFP Active Optical Cables
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The 4-Channel QSFP Active Optical Cable
(QSFP-AOC) provides bi directional electricalelectrical
connectivity over distances up to 100 meters using multimode
optical fiber. Each independent channel is capable of
5, 8 or 10 Gbps for an aggregate bi-directional bandwidth
of up to
40 Gbps*. The QSFP-AOC module offers an extremely compact
solution for DDR/SDR Infiniband™, 10 Gigabit Ethernet
CX4 (XAUI), 4 x OC-48 SONET, multi-lane PCI Express, 10
Gigabit Fibre Channel, as well as proprietary backplane
interconnections. |
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Optical Media Converter Pigtailed
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The Optical Media Converter (OMC) provides
full-duplex four-channel electrical-electrical connectivity
over distances up to 300 meters using multimode optical
fiber.
The OMC offers direct connectivity with 10 Gigabit Ethernet
CX4 (XAUI), DDR/SDR/QDR Infiniband™, 4 x OC-48 SONET,
multi-lane PCI Express, 10 Gigabit Fibre Channel, as well
as proprietary backplane interconnections.
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OMC Active Optical Cables
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The Optical Media Converter (OMC) Active
Optical Cable provides full-duplex four-channel electrical-electrical
connectivity over distances up to 300 meters using multimode
optical fiber.
The OMC Active Optical Cable offers direct connectivity
with 10 Gigabit Ethernet CX4 (XAUI), DDR/SDR/QDR Infiniband™,
4 x OC-48 SONET, multi-lane PCI Express, 10 Gigabit Fibre
Channel, as well as proprietary backplane interconnections. |
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| Reflex Photonics’ Light
On Board technology provides optically enabled semiconductor-packaging
solutions for ultra short reach (USR) interconnections
to and between integrated circuits (ICs) on a single printed
circuit board (PCB) – effectively enabling a “chip
package-to-chip package” and a “fiber-to-the-chip
package” solution. Light On Board is
an extreme high-speed interconnect solution that offers
superior performance without disrupting current manufacturing
methodologies that use standard IC packaging and standard
PCBs, automated equipment and processes. Light On Board
technology continues to respect all aspects of IC packaging
and board assembly such as package size, footprint,
solder-re-flow and chip interconnections since it is
extremely important not to disrupt the processes developed
by IC and PCB manufacturers. All existing electrical
high-speed connections to the ASIC are maintained in
addition to the optical connections added with Light
on Board and all optically enabled chip packages are
connected via industry standard multi-fiber ribbon cables
and patent pending Light on Board mating clips.
Light on Board provides a platform for connections
to ASICs by introducing pre-aligned optical-to-electrical
(or electrical-to-optical) channel connector modules
into standard IC packages. Integrated within the channel
connector modules are Reflex’s pre-aligned LightABLE™
Optical Engines: compact, encapsulated, thin modules
that can be pick-and-placed into the IC package along
side the chip. The distance between the ASIC and the
LightABLE Optical Engine is significantly less
than one inch, in order to immediately convert the ultra-high
speed electrical signals into optical signals. Because
Light on Board focuses on USR interconnects to and between
ICs on a single PCB, it effectively enables “chip
package-to-chip package” and “fiber-to-the-chip
package” solutions.
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Optically Enabled BGA
Packaging
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Reflex Photonics now offers unique semiconductor
packaging technology which enables high-speed optical
input and output signals to be directly connected
to the chip – effectively enabling a “fiber-to-the-chip
package” solution. This innovative technology
incorporates the most advanced assembly processes,
using industry standard packaging automation and allows
applications to maximize the bandwidth of semiconductor
Integrated Circuits (ICs).
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Light on Board®
HyperDense™
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 HyperDense,
the first product line in the company’s Light
on Board product family consists of parallel channel
optical components that focus on intra and inter printed
circuit board (PCB) applications and support all physical
layer protocols. Each HyperDense component features 12
individual parallel fiber optic channels integrated
into MT-based I/O connector modules, with each channel
capable of speeds of up to 10 Gbps. The HyperDense products
can be configured as transmitters, receivers or transceivers,
with up to eight I/O connector modules available to
be ordered for each type of product.
HyperDense optically enabled BGA chip-packaging
technology offers both high-speed electrical I/O and
direct access to up to 96 optical channels, employing
Reflex’s pre-aligned, next generation LightABLE
optical engines.
The optical channels on the HyperDense
package completely eliminate the difficulties of routing
high-speed traces on the PCB by sending the incoming
and outgoing data (up to 10 Gbps per channel) from the
chip directly to the optical engines located at the
package edge.
HyperDense packaging has no impact on
existing electrical design protocols. This technology
provides an extremely cost-effective solution for utilizing
the full bandwidth of high-performance chips.
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