InterBOARD®

Reflex Photonics offers three families of parallel optical modules:

• CFP Parallel Optical Modules

Designed to support the IEEE 100GBASE-SR10 specification; the newly developed CFP transceiver module provides increased port density and total system cost savings. The Reflex CFP module has a single MPO port which connects to an industry standard 2x12 multi-mode fiber cable. The module has been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference using Reflex Photonics’ next generation, LightABLE™ packaging technology. The modules offer very high functionality and feature integration, accessible via an MDIO interface.

• QSFP+ Transceiver

Designed to support the IEEE 40GBASE-SR4 and Infiniband™ QDR specifications; the 4-channel 40 Gbps QSFP+ Transceiver provides bi-directional electrical-to-optical / optical-to-electrical connectivity of over 300 meters using a parallel channel, multimode optical fiber cable. This 300 m reach is more than 3x the distance required by the IEEE standard, enabling very large data center applications. The QSFP+ offers an extremely compact and lightweight solution for 40 Gbps Ethernet, QDR InfiniBand™ and proprietary backplane interconnections to provide increased port density and total system cost savings. The Reflex QSFP+ has an industry standard single 12-fiber MPO port and has been designed to meet harsh operating conditions including temperature, humidity and EMI interference using Reflex Photonics’ next generation, LightABLE™ packaging technology.

• SNAP12 Parallel Optical Modules

The Transmitter and Receiver modules enable high performance multi-channel optical links designed for high-speed data communications and computing applications where very short reach bandwidth bottlenecks are incumbent. These modules are compliant to the SNAP12 MSA and are adopted by the leading systems OEMs for chassis intra-connect. In terms of Gb/s, they offer a solution with the lowest cost and the highest packaging density. Consisting of 12 independent optical channels, each channel is capable of transmission speeds of up to 6.25 Gbps and for distances of up to 300-m on 50 micron multimode optical fiber.

• Light On Board® (Optically Enabled ASIC Packaging)

Reflex Photonics’ Light On Board technology provides optically enabled semiconductor-packaging solutions for ultra short reach (USR) and short reach (SR) interconnections to and between integrated circuits (ICs) on a single printed circuit board (PCB), between adjacent PCB's and adjacent equipment chassis.

Light On Board is an extreme high density, high-speed interconnect solution that offers superior performance without disrupting current manufacturing methodologies that use standard IC packaging and standard PCBs, automated equipment and processes. Light On Board technology continues to respect all aspects of IC packaging and board assembly such as package size, footprint, solder-re-flow and chip interconnections since it is extremely important not to disrupt the processes developed by IC and PCB manufacturers. All existing electrical high-speed connections to the ASIC are maintained in addition to the optical connections added with Light on Board and all optically enabled chip packages are connected via industry standard multi-fiber ribbon cables and patent pending Light on Board mating clips.

Light on Board provides a platform for optical connectivity by introducing pre-aligned optical-to-electrical (or electrical-to-optical) channel connector modules next to IC packages. Integrated within the channel connector modules are Reflex’s pre-aligned LightABLE™ Optical Engines: compact, encapsulated, thin modules that can be pick-and-placed into the IC package along side the chip. The distance between the ASIC and the LightABLE Optical Engine is significantly less than one inch, in order to immediately convert the ultra-high speed electrical signals into optical signals.

• Optical BGA Packaging

Reflex Photonics now offers unique semiconductor packaging technology which enables high-speed optical input and output signals to be directly connected to the chip – effectively enabling a “fiber-to-the-chip package” solution. This innovative technology incorporates the most advanced assembly processes, using industry standard packaging automation and allows applications to maximize the bandwidth of semiconductor Integrated Circuits (ICs).