Products

Reflex Photonics provides advanced optical interconnects based on its unique, high-volume and low-cost approach to optical assembly. Using its core LightABLE™ technology the following market segments are addressed:

1) InterBOARD®: Parallel optical transceivers for high-density interconnections between boards and systems, and

2) Light On Board®: Optically enabled semiconductor packaging for interconnections to and between Integrated circuits (ICs).

For further information, contact sales at sales@reflexphotonics.com

 

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InterBOARD®

Reflex Photonics offers three families of parallel optical modules:

   

Designed to support the IEEE 100GBASE-SR10 specification; the newly developed CFP transceiver module provides increased port density and total system cost savings. The Reflex CFP module has a single MPO port which connects to an industry standard 2x12 multi-mode fiber cable. The module has been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference using Reflex Photonics’ next generation, LightABLE™ packaging technology. The modules offer very high functionality and feature integration, accessible via an MDIO interface.

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Designed to support the IEEE 40GBASE-SR4 and Infiniband™ QDR specifications; the 4-channel 40 Gbps QSFP+ Transceiver provides bi-directional electrical-to-optical / optical-to-electrical connectivity of over 300 meters using a parallel channel, multimode optical fiber cable. This 300 m reach is more than 3x the distance required by the IEEE standard, enabling very large data center applications. The QSFP+ offers an extremely compact and lightweight solution for 40 Gbps Ethernet, QDR InfiniBand™ and proprietary backplane interconnections to provide increased port density and total system cost savings. The Reflex QSFP+ has an industry standard single 12-fiber MPO port and has been designed to meet harsh operating conditions including temperature, humidity and EMI interference using Reflex Photonics’ next generation, LightABLE™ packaging technology.

 
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LightABLE™

   

The Reflex Photonics LightABLE™ Optical Engine is an integrated solution for converting between high-speed electrical and optical I/O. The LightABLE Optical Engine is a low-profile pre-aligned parallel electrical - to - optical (or optical - to - electrical) transmitter (or receiver). The optical engines can be plugged onto a printed circuit board via a 100-pin connector or mounted directly via surface mount BGA technology. Short electrical traces from the Host ASIC connect high-speed electrical data signals to the Reflex LightABLE optical engine..

Highlights
• 12 transmit or receive channels per engine
• Industry standard MT-terminated multi-mode parallel fiber connector
• Requires only 2.3 cm2 of PCB area
• Dissipates only 70 mW per channel   
• Up to 11.2Gbps per channel
• 100 pin pluggable Meg-array™ connector or surface mountable 1.27 mm pitch BGA
• Self-contained (no other components required to operate)
• 850nm wavelength; transmission distances of >100m on OM3 fiber
• Pre-aligned
• RoHS compliant
• CML high-speed electrical interface
• I2C communication interface

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The Reflex Photonics 40G LightABLE™ Optical Engine is an integrated solution for converting between high-speed electrical and optical I/O. The LightABLE Surface Mount Optical Engine is a low-profile pre-aligned parallel electrical - to - optical / optical - to - electrical transceiver. The optical engines can be plugged onto a printed circuit board via a 100-pin connector or mounted directly via surface mount BGA technology. Short electrical traces from the Host ASIC connect high-speed electrical data signals to the Reflex LightABLE optical engine.

Highlights
• 4 transmit and 4 receive channels per engine
• Industry standard MT-terminated multi-mode parallel fiber connector
• Requires only 2.3 cm2 of PCB area
• Up to 11.2 Gbps per channel
• 100 pin pluggable Meg-array™ connector or surface mountable 1.27 mm pitch BGA
• Self-contained (no other components required to operate)
• 850nm wavelength; transmission distances of >100m on OM3 fiber
• Pre-aligned
• RoHS compliant
• CML high-speed electrical interface
• I2C communication interface

4+4 Pluggable LightABLE

Reflex Photonics’ Light On Board technology provides optically enabled semiconductor-packaging solutions for ultra short reach (USR) and short reach (SR) interconnections to and between integrated circuits (ICs) on a single printed circuit board (PCB), between adjacent PCB's and adjacent equipment chassis.

Light On Board is an extreme high density, high-speed interconnect solution that offers superior performance without disrupting current manufacturing methodologies that use standard IC packaging and standard PCBs, automated equipment and processes. Light On Board technology continues to respect all aspects of IC packaging and board assembly such as package size, footprint, solder-re-flow and chip interconnections since it is extremely important not to disrupt the processes developed by IC and PCB manufacturers. All existing electrical high-speed connections to the ASIC are maintained in addition to the optical connections added with Light on Board and all optically enabled chip packages are connected via industry standard multi-fiber ribbon cables and patent pending Light on Board mating clips.

Light on Board provides a platform for optical connectivity by introducing pre-aligned optical-to-electrical (or electrical-to-optical) channel connector modules next to IC packages. Integrated within the channel connector modules are Reflex’s pre-aligned LightABLE™ Optical Engines: compact, encapsulated, thin modules that can be pick-and-placed into the IC package along side the chip. The distance between the ASIC and the LightABLE Optical Engine is significantly less than one inch, in order to immediately convert the ultra-high speed electrical signals into optical signals.

 

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Reflex Photonics now offers unique semiconductor packaging technology which enables high-speed optical input and output signals to be directly connected to the chip – effectively enabling a “fiber-to-the-chip package” solution. This innovative technology incorporates the most advanced assembly processes, using industry standard packaging automation and allows applications to maximize the bandwidth of semiconductor Integrated Circuits (ICs).

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The Transmitter and Receiver modules enable high performance multi-channel optical links designed for high-speed data communications and computing applications where very short reach bandwidth bottlenecks are incumbent. These modules are compliant to the SNAP12 MSA and are adopted by the leading systems OEMs for chassis intra-connect. In terms of Gb/s, they offer a solution with the lowest cost and the highest packaging density. Consisting of 12 independent optical channels, each channel is capable of transmission speeds of up to 6.25 Gbps and for distances of up to 300-m on 50 micron multimode optical fiber.

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About Us

Reflex Photonics Inc. is a privately held corporation founded in 2002 that is focused on delivering high performance interconnects for next generation optical and semiconductor connectivity solutions.