Light On Board® OE-ASIC

Optically enabled ASIC packaging technology

The Reflex Photonics Light on Board Optically Enabled Packaging technology is a fully integrated solution for converting between high-speed electrical and optical I/O.

The Light on Board optically enabled packaging technology is comprised of pre-aligned low-profile optical sub-assemblies (LightABLE) mounted upon a high-speed printed circuit board along with the ASIC. Short traces connect the high-speed electrical TX and RX signals to the Reflex LightABLE optical engines. Multi-fiber optical ribbons then attach to the optical engines for connectivity between chassis’, blades, and ICs.

For further information, contact sales at sales@reflexphotonics.com

Specifications and Features Highlights:

• 4, 12, 24, 48 or 72 TX and RX channels standard in an IC package.
• Up to 10.4 Gbps per channel
• No optical alignment necessary
• RoHS compliant
• Can be fitted into existing designs without PCB spin via custom high speed socket
  

Applications:

High-speed optoelectronic data conversion for

• 1G & 10G Serial Ethernet
• 4 x 3.125G 10G Ethernet links
• 4G & 8G Fibre Channel
• InfiniBand® DDR and QDR
• PCI Express® 1.1, 2.0 and 3.0
• Serial Rapid IO™
• SATA-IO™ 3.x
• Proprietary inter and intra board systems