OE-BGA

Optical Ball Grid Array Flip-Chip Package

Reflex Photonics’ Optical Flip-Chip BGA semiconductor packaging technology combines the benefits of optical transmitter and receiver interconnections with the advantages of wafer bumping technology. The ability to connect optical signals to the package effectively enables a “fiber-to-the-chip” connection. This innovative technology incorporates the most advanced assembly processes, which allows applications to maximize the bandwidth of semiconductor integrated circuits (ICs).

The high performance optical FC-BGA packages introduce ASIC/SOC design flexibility by allowing optimized signal I/O placement. Each optical MT connector consists of up to 12 independent transmit or receive optical channels. Each channel is capable of transmitting up to 10 Gbps up to 300m on 50-micron multi-mode fiber.

Additionally, the optical FC-BGAs utilize industry proven, semiconductor grade materials for reliable, long-term operations while providing the user flexible design parameters. The packages have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference and integrate Reflex’s next generation, LightABLE™ optical packaging technology.

Key Benefits:

  • High-Speed Optical Transmit and Receive Capability Interconnected to the Chip
  • Outstanding high-speed capabilities via LightABLE™ optical technology
  • Up to 960 Gbps of Unidirectional Optical Bandwidth

For further information, contact sales at sales@reflexphotonics.com

 

Specifications and Features Highlights:

  • Signal placement throughout die
  • Die sizes up to 400X400 mils
  • Up to 1936 solder balls
  • Custom packages in body sizes ranging from 35 x 35 mm to 45 x 45 mm
  • 1.0 & 1.27 mm ball pitches available
  • Controlled Impedance Electrical I/O
  • Up to 96 optical channels
  • Up to 10 Gbps per channel optical performance
  • Excellent Reliability
  • Up to 10 Laminate Metal layers
  • Optional grounded heat spreader
  • Eutectic of Pb-free versions available

Applications:

  • High-speed, high-power semiconductors:
    • ASICs
    • Microprocessors
    • DSP and FPGA requiring high-performance packages.
  • Solution for bandwidth, power and space requirements of:
    • Internet Routers
    • Switches
    • Network Servers
    • Systems on a Chip

 

Optical Ball Grid Array (OE-BGA) Cavity Down Package

The high performance optical BGA packages are offered in a deep cavity down architecture with multiple wire bonding tiers for power, ground, electrical signals and optical signals. The integrated circuit (IC) is mounted on a copper heat spreader and each optical MT connector consists of up to 12 independent transmit or receive optical channels. Each channel is capable of transmitting up to 10 Gbps up to 300m on 50-micron multimode fiber.

Additionally, the optical BGAs utilize industry proven, semiconductor grade materials for reliable, long-term operation while providing the user flexible design parameters. The packages have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference, and integrate Reflex’s next generation, LightABLE™ optical packaging technology.

Key Benefits:

  • High-speed Optical Inputs and Outputs Directly to the Chip
  • Outstanding high-speed capabilities via LightABLE™ optical technology
  • Up to 960 Gbps of Unidirectional Optical Bandwidth

For further information, contact sales at sales@reflexphotonics.com

 

Specifications and Features Highlights:

  • Inverted Cavity Configuration
  • Die sizes up to 400X400 mils
  • 352 to 1140 ball count
  • Custom packages in body sizes ranging from 35 x 35 mm to 45 x 45 mm
  • 0.8, 1.0 & 1.27 mm ball pitches available
  • Superior Thermal Performance
  • Up to 96 Optical Input or Output channels
  • Up to 10 Gbps per channel optical performance
  • Excellent Reliability
  • Up to 10 Laminate Metal layers
  • Optional grounded heat spreader
  • Deep Cavity Down Architecture with Multiple Wire Bonding Tiers
  • Eutectic of Pb-free versions available

Applications:

  • High-speed, high-power semiconductors:
    • ASICs
    • Microprocessors
    • DSP and FPGA requiring high-performance packages.
  • Solution for bandwidth, power and space requirements of:
    • Internet Routers
    • Switches
    • Network Servers
    • Systems on a Chip

OE-BGA Packaging - Product Briefs & White Papers

Product Numbers

Description

Documentation

Coming soon

Optically-Enabled Ball Grid Array (OE-BGA)
Cavity Down Package

Product Brief

Coming soon

Optically-Enabled Ball Grid Array Flip-Chip Package

Product Brief

N/A

Reflex Photonics OE-BGA Prototype Results WhitePaper

White Paper

N/A

N/A

Reflex Photonics Light On Board® Technology Overview White Paper

White Paper

N/A

Corporate

 

Products

 

About Us

Reflex Photonics Inc. is a privately held corporation founded in 2002 that is focused on delivering high performance interconnects for next generation optical and semiconductor connectivity solutions.